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HOME ＞ Technologies & Products ＞ Laser Processing Systems ＞ Ultra-High-Precision Drilling
Ultra-High-Precision Drilling
Ultra-high-precision drilling made possible using a beam rotator and galvano scanner manufactured in-house
Equipment external view
Strengths
■ Straight hole drilling
■ Fine drilling with excellent circularity, high degree of freedom
■ Round holes, square holes, holes with special shapes
■ Control over hole diameter, taper at the entry and exit sides
■ Processing position accuracy:<1μm
Target materials
Resin, Ceramic (Silicon nitride / Silicon carbide), Polyimide, SUS, Sapphire substrate, Artificial diamond
Equipment features
Control of the radius of rotation and the angle of incidence with a beam rotator enables a variety of hole shapes
Beam rotator manufactured in-house
Examples
Small-hole drilling
Entry side
Silicon nitride
Thickness 0.25 mm
Hole dia. 20 μm
Pitch 26 μm
Machining speed 1.2 sec/hole
Exit side
Beam entrance
Silicon nitride
Thickness 0.25 mm
Square hole size 20 μm on a side
Pitch 28 μm
Machining speed 1.4 sec/hole
Beam exit
Narrow-pitch hole drilling
Entry side
Super engineering plastic
(PEEK material)
Hole dia. 30 μm
Pitch 38 μm
Exit side
Entry side
Super engineering plastic
(PEEK material)
Square hole size 30 μm on a side
Pitch 38 μm
Exit side
Straight hole drill machining
Cross Section
Super engineering plastic (LCP material)
Thickness 0.4 mm
Hole dia. 250 μm
Pitch 270 μm
Machining speed 3 sec/hole
Cross Section
Super engineering plastic (LCP material)
Hole dia. 15 μm
Pitch 27 μm
Machining speed 1.5 sec/hole
Special tapered hole machining
Cross Section
Cross Section
