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HOME ＞ Technologies & Products ＞ Laser Processing Systems ＞ Precision Laser Cutting
Precision Laser Cutting
Optimized oscillator and optical system configurations make it possible to cut even the most challenging materials
Equipment external view
Equipment information
■ An abundant lineup of laser oscillators and optical systems
■ Makes it possible to appropriately configure conditions for processing-resistant materials
■ Selectable UV, Gr, and IR lasers
Target materials
Resin, Sapphire, Alumina, FPC board, SUS
Processing examples
Alumina
Entry side
Cross section
Thickness 0.19 mm
Machining speed 500 mm/sec
SiC before sintering
Entry side
Cross section
Thickness 0.7 mm
Machining speed 50 mm/sec
Sapphire
Entry side
Cross section
Thickness 0.37 mm
Machining speed 5 mm/sec
SUS430
Entry side
Cross section
Thickness 0.15 mm
Machining speed 100 mm/sec
